Bare Die Trays are high-precision carriers specifically designed for unpackaged wafers (Die/WLCSP), passive components, and LEDs. Made of conductive/antistatic ABS, PC or HIPS materials, they offer excellent dimensional stability and protection. Their structure includes high-precision dimensional dies, effectively preventing tilting, displacement, detachment, or surface damage to the bare die during storage, transportation, and SMT processes, and protecting it from electrostatic discharge.

Key Features：

• High precision and protection: The cavity size tolerance is ±0.05mm, and Cpk>1.33, Warpage<0.1mm, making it suitable for ultra-thin and ultra-small wafers with a high capacity per unit volume.
• Electrostatic protection: Surface impedance, antistatic ABS is typically 10⁹≦R<10¹¹Ω, and conductive HIPS is typically R<10⁶Ω, providing a variety of excellent electrostatic protection effects.
• Cleanroom production: Dust removal and inspection are carried out in a Class 100 cleanroom, which has low pollution characteristics.
• Materials comply with international standards such as RoHS.