Designed Specifically for Driver IC COG Process

Anti-static IC trays are specifically designed for driver IC COG (Chip on Glass) shipping processes. Using special anti-static material formulations, surface resistance is stably controlled within safe ranges, effectively preventing electrostatic discharge (ESD) damage to sensitive IC components. Products pass rigorous static testing to ensure optimal protection throughout transportation and storage.

High-Precision Mold Forming Technology

We utilize high-precision injection molding technology and precision molds to ensure dimensional accuracy and flatness for each chip pocket. The tray structure design has been optimized to securely hold chips and prevent displacement or damage during transportation. High-rigidity materials ensure the tray body resists deformation, maintaining perfect flatness even when stacked in multiple layers, fully compatible with various IC processes and automated equipment.

Industry Standard Compliant and Customizable

Products comply with semiconductor industry standard specifications and can be customized according to customer requirements for different sizes, pocket quantities, and anti-static grades. Our engineering team can work with your special process requirements to provide the most suitable tray solutions.