Key characteristics of antistatic PC chip tray：
- Antistatic properties: Surface resistivity is typically controlled within 10⁹ ≦R < 10¹² Ω/sq, rapidly dissipating charge.
- High temperature resistance: It can withstand baking temperatures and is suitable for IC packaging processes.
- Dimensional stability: Excellent impact resistance and mechanical strength ensure accuracy in automated operations.
Manufacturing method：
- Injection molding: High-precision tray
Common application：
- Semiconductor die transportation and storage.
- IC packaged finished product shipping tray.
- COG（Chip on Glass）driver IC。