Designed Specifically for DPS(Die Processing Service)
We offer a variety of special plastic material formulations, to select the appropriate surface resistivity specifications based on the microchip requirements to keep stably within a safe surface resistivity range to ensure optimal protection throughout the entire transportation and storage process.
High-Precision Mold and Injection Technology
We utilize high-precision injection molding technology to ensure the dimensional accuracy and flatness of cavity. The tray's structural design has been optimized, incorporating UTYC patented design features, to firmly press and fix the IC, preventing chip jumping, displacement, or damage during transportation. High mechanical property materials ensure the tray is not easily deformed, maintaining perfect flatness even in multi-layer stacking, making it fully compatible with various IC manufacturing processes and automated equipment.
Industry Standard Compliant and Customizable
Products comply with semiconductor industry standard specifications and can be customized according to customer requirements for different sizes, pocket quantities, and anti-static grades. Our engineering team can work with your special process requirements to provide the most suitable tray solutions.